Professor of Chemical Engineering

Research Areas

Semiconductor Chemical Process & Electrodeposition

Research Interests

Electrodeposition stands as a pivotal electrochemical process renowned for its ability to produce high-quality metal and alloy films with ease. Its versatility extends to the fabrication of both smooth metal films and intricate 3D nanostructures, also offering precise control over the microstructures of metal deposits across diverse research fields for multifaceted applications. Achieving optimal performance in each application necessitates the meticulous design of electrolytes and the fine-tuning of electrochemical parameters of electrodeposition. Moreover, the integration of organic or inorganic additives is indispensable for tailoring the properties and surface morphologies of metal deposits. These additives play a crucial role by adsorbing onto the growing metal surface, exerting intricate control over the thermodynamics and kinetics of electrochemical metal growth. Thus, the advancement of electrodeposition techniques hinges upon a profound understanding of how additives influence the electrochemical growth of metals. Our research is primarily centered on unraveling the electrochemical behavior of additives, meticulously designing their molecular structures, and ultimately propelling the advancement of electrochemical deposition techniques.

Metallization of semiconductor devices: from Damascene Interconnection to Advanced Packaging
Semiconductor devices today feature a variety of metal interconnections, ranging from nanometer-scale Damascene interconnections to micrometer-scale interconnections for advanced packaging, including through-silicon vias (TSVs), microbumps, solder joints, redistribution layers (RDLs), microvias, and through-holes. Regardless of their size, these interconnections are entirely fabricated using electrodeposition techniques. The selection of additives in the electrodeposition process varies based on the interconnection scale, aiming to achieve defect-free structures and enhance process efficiency by reducing processing times. Our current research focuses on the development of improved organic and inorganic additives, as well as their combinations, to propel the advancement of electrodeposition techniques in semiconductor fabrication processes.

Aqueous battery: Designing Electrolyte and Additives for Boosting Battery Performance
Aqueous batteries, including Zn ion batteries, have garnered attention for grid-scale energy storage systems (ESSs), offering a solution to balance the fluctuations between renewable energy production and consumption. Zn ion batteries are heralded for their environmental friendliness, safety, longer lifespan, and cost-effectiveness compared to conventional Li ion batteries. However, challenges such as hydrogen evolution reactions (HER), Zn dendrite formation, corrosion, and other limitations hinder the widespread adoption of Zn ion batteries. Hence, our primary objective is the development of enhanced electrolytes and additives specifically designed for Zn ion batteries, aiming to improve their performance and extend their lifespan. Specifically, we are investigating additives with the ability to suppress the growth of Zn dendrites.

Electrochemical Deposition of Metal Nanostructures for Electrocatalysis
While both colloidal syntheses and electrodeposition utilize additives for metal growth, electrodeposition offers a more limited range of nanostructures. In the typical electrodeposition process, templates such as anodized aluminum oxide or polystyrene spheres are necessary to guide metal nanostructure growth. This limitation arises from the inability to fully harness the effects of adsorbates during metal growth, due to relatively rapid deposition rates and the domination of substrate effect. To broaden the utility of electrodeposition for electrocatalysis and fine-tune metal nanostructure properties, we aim to enhance the electrodeposition technique to produce atomically controlled nanostructures by amplifying the influence of adsorbates. Additionally, we are investigating how these nanostructures contribute to improving electrocatalysis.

Selected Publications

1. T.B. Ngoc Huynh, Jihyeok Song, Hyo Eun Bae, Youngkwang Kim, Michael D. Dickey, Yung-Eun Sung,* Myung Jun Kim,* and Oh Joong Kwon,* “Ir–Ru Electrocatalysts Embedded in N-doped Carbon Matrix for Proton Exchange Membrane Water Electrolysis”, Adv. Funct. Mater., 33, 2301999 (2023).
2. Byung Keun Kim, Myung Jun Kim,* and Jae Jeong Kim,* “Modulating the active sites of nickel phosphorous by pulse-reverse electrodeposition for improving electrochemical water splitting”, Appl. Catal. B, 308, 121226 (2022).
3. Myung Jun Kim,# Mutya A. Cruz,# Zihao Chen,# Heng Xu, Micah Brown, Kristen A. Fichthorn, Benjamin J. Wiley, “Isotropic iodide adsorption causes anisotropic growth of copper microplates”, Chem. Mater., 33, 881-891 (2021).
4. Feichen Yang,# Myung Jun Kim,# Micah Brown, and Benjamin J. Wiley, “Alkaline water electrolysis at 25 A cm-2 with a microfibrous flow-through electrode”, Adv. Energy Mater., 10, 2001174 (2020).
5. Myung Jun Kim, Youngran Seo, Mutya A. Cruz, and Benjamin J. Wiley, “Metal nanowire felt as a flow-through electrode for high-productivity electrochemistry”, ACS Nano, 13, 6998-7009 (2019).
6. Da Huo,# Myung Jun Kim,# Zhihneg Lyu,# Yifeng Shi,# Benjamin J. Wiley, and Younan Xia, “One-dimensional metal nanostructures: From colloidal syntheses to applications”, Chem. Rev., 119, 8972-9073 (2019).
7. Myung Jun Kim, Samuel Alvarez, Zihao Chen, Kristen A. Fichthorn, and Benjamin J. Wiley, “Single-crystal electrochemistry reveals why metal nanowires grow”, J. Am. Chem. Soc., 140, 14740-14746 (2018).
8. Myung Jun Kim,# Samuel Alvarez,# Tianyu Yan, Vaibhav Tadepalli, Kristen A. Fichthorn, and Benjamin J. Wiley, “Modulating the growth rate, aspect ratio, and yield of copper nanowires with alkylamines”, Chem. Mater., 30, 2809–2818 (2018).
9. Seungyeon Baek, Kwang Hwan Kim, Myung Jun Kim,* and Jae Jeong Kim,* “Morphology control of noble metal catalysts from planar to dendritic shapes by galvanic displacement”, Appl. Catal. B, 217, 313–321 (2017).
10. Myung Jun Kim, Patrick F. Flowers, Ian E. Stewart, Shengrong Ye, Seungyeon Baek, Jae Jeong Kim, and Benjamin J. Wiley, “Ethylenediamine promotes Cu nanowire growth by inhibiting oxidation of Cu (111)”, J. Am. Chem. Soc., 139, 277–284 (2017).

Professional Experience

경희대학교 응용화학과 조교수 (2020-2024)
Duke University 박사후 연구원 (2016-2020)
서울대학교 박사후 연구원 (2013-2015)